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PaperCon 2019

Date: May 5, 2019 - May 8, 2019

Location: Indianapolis Convention Center | Indianapolis, IN, U.S.A.

Booth No: 907

PaperCon is the world's largest technical conference for the paper and packaging industry. Developed by technical experts and business leaders in the paper, packaging and nonwovens industry, PaperCon 2019 offers networking events and technical sessions that provide tangible take-aways to solve many of today's technical challenges.
Solenis is well-positioned to help our customers to address the challenges they face daily in this dynamic industry. Solenis experts will be on hand to discuss the latest developments for pulp, packaging, and printing/writing markets. 

Visit us at booth 907 to learn more about OPTIX™ applied intelligence, Fusion℠ strength and performance technology, MicroSol™ advanced retention and drainage, and TopScreen™ ED/Ultra bio-wax barrier coatings.

Solenis experts will present the following papers:

Fractionating - New Reveals of Stock Retention Mechanisms with Optimized Use of and Mixing of Additives in Paper and Board Production by Solenis, Valmet Automation, WetEnd Technologies and XAMK during Session PA1 on May 6.

Creating Adaptive Predictions for Packaging Critical Quality Parameters Using Advanced Analytics and Machine Learning by Cydney Rechtin, Platform Specialist, OPTIX during Session PC5 on May 7.

Development of More Sustainable Barrier Systems for Packaging by Larry Hutchinson, Global Market Development Manager during Session PA3 on May 7.

New Lignin Management Program Improves Strength and Performance in Virgin Containerboard by Cory Ross, N.A. Packaging Market Manager and Davit Sharoyan, Principal Scientist, during Session PA7 on May 8.

For more information about PaperCon, click here.